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Thermal conductivity

DAIKIN adds thermal conductivity as a special characteristic in our broad line-up of products (plastics, elastomer, coatings, greases...) to help manage upcoming challenges in heat dissipation and transfer.

ABOUT

The need for thermally conductive polymers

Polymer resins are versatile materials due to properties such as processability and relative strength. However, their relatively low thermal conductivity can present an engineering challenge when applied near a heat source or in metal replacement applications.


The required electrical properties of the resins vary depending on the application. Daikin offers both electrically-insulative and electrically-conductive solutions.


  • - Performance and cooling of semiconductors / reliable electronics

The push to pack increasing amount of computing power into ever-smaller semiconductor packages, leads to an increasing engineering challenge to remove the dissipated heat from the electronic components.

With the advancement of 5G and high-frequency signals, there is a need to improve thermal conductivity of substrate materials while maintaining low dielectric properties for signal integrity.


  • - Automotive electrification

E-powertrain components such as motors, inverters, and battery packs generate less heat than combustion engines; however, their performance and safety are also more sensitive to temperature increases.

When designing these components, every layer’s thermal properties need to be considered to secure sufficient heat flow from source to sink.


  • - Metal replacement

Plastics are a good alternative to metals due to their lower tooling costs and design versatility. In some metal replacement applications through standard plastics, thermal conductivity is compromised. Plastics with high thermal conductivity are required.

OUR SOLUTION

Thermally-conductive, low Dk PFA resin (under development)

This material combines the outstanding properties of PFA resins (best-in-class thermal and chemical stability among melt-processable resins) with a high level of thermal conductivity, while maintaining the low dielectric of fluoro-materials. This unique proposition makes it an excellent material for electronics applications such as PCB substrates or films.

Characteristics

- Electrical insulation : Best in class among plastics

- Dielectric properties : Low Dk, low Df

- Temperature resistance : CUT of 260℃

- Chemical resistance : Non-reactive to most chemicals

- Flame retardancy : UL94 V-0, critical oxygen index > 95%

TC_PFA_image1.png

Thermal properties

Measurement Units Dev. grade  Std. grade

Thermal conductivity


Thru-plane

W/m·K

0.9

0.2

In-plane

2.8

-

Thermal resistance

Thru-plane m2·K/W 3.3x10-3 10x10-3

Measurement : Periodic radiant heating method

Thermal conductivity (W/m·K)= ρ × Cp × α, ρ: density (kg/m3), Cp: specific heat capacity (J/kg·K), α: Thermal diffusivity (mS-1)

Thermal resistance : for 2mm, 1m2

The above numeric values are representative and not guaranteed.

TC_PFA_thermograph

Other properties

Item Condition Units Dev. grade Std. grade

Dk

6GHz

-

2.6

2.1

Df

6GHz x10-4 9 3

Volume resistivity

JIS K 6911 Ωcm ≧1016 ≧1016

Dielectric strengh

IEC60243-1 /1mmt kV/m 44 44

CTI

IEC60112 /3mmt V 600 600

Tensile strength

ASTM D 638 MPa 27 20
Elongation at break % 3 >100
Flexural modulus ASTM D 790 GPa 2.1 0.6
Izod impact strength

ASTM D 256

(notched)

J/m 32

NB

The above numeric values are representative and not guaranteed.

Thermally-conductive, tough PPS (under development)

PPS compound suitable for metal replacement applications due to its good balance between thermal and mechanical properties.

Material with excellent thermal conductivity and processability below 1mm wall thickness. Further customization of properties for specific applications also possible.

Thermal-physical properties

Measurement direction Units

Low warp type

PPS

High strength type

PPS

General

PPS

Thermal conductivity

In plane

W/m·K

12

13

0.3

Thru plane W/m·K 2.5 2.5 0.3

Measurement method : Laser flash method

Thermal conductivity (W/m·K)=ρ × Cp × α, ρ: density (g/cm3), Cp: specific heat capacity (J/g·K), α: Thermal diffusivity (m2/s)

The above numeric values are representative and not guaranteed.

TC_PPS_thermograph

Table of physical properties

In addition to the above thermal and physical properties, it has excellent heat reistance and mechanical properties.

Item Condition Units

Low warp type

PPS

High strength type

PPS

Density

ISO 1183

g/cm3

1.7

1.7

Tensile strength

ISO 527-2 MPa 50 70

Tensile elongation

% 1.1 1.1

Flexural strength


ISO 178
MPa 80 100

Flexural modulus

MPa 16,000 20,000

Charpy impact strength

ISO 179-1, 2

(unnotched)

kJ/m2 5 5
Heat deflection temperature (1.8MPa) ISO 75-2 240 240

The above numeric values are representative and not guaranteed.

APPLICATIONS

thermal-conductivity-automotive

thermal-conductivity-electronics.jpg

thermal-conductivity-aerospace.jpg

Thermally-conductive materials are increasingly required for heat dissipation and removal in various industries such as automotive, electronics or aerospace. Each specific design requires a matching level of thermal conductivity in the appropriate carrier material.

At DAIKIN, we combine a broad portfolio of materials with our compounding expertise to provide excellent thermal conductivity without compromising the mechanical and chemical properties of fluoro-materials.

  • Motor housings
  • Inverter housings and PCB
  • Battery pack
  • Heat exchangers
  • High-frequency PCB substrates
  • Antenna housings
  • Connectors
  • Avionics housings