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Semicon Etching Agents

DAIKIN provides high quaity etching agents for wet and dry fluorine types for semiconductor manufacturing. 

DESCRIPTION

DAIKIN provides etching agents for wet and dry fluorine types for semiconductor manufacturing. For wet etching agents, we provide high quality products in which impurities such as metal-ions, etc., are minimized. We also handle grades with improved permeability and reduced particle adhesion onto wafers by adding a unique surfactant.

GRADES & FEATURES

Wet Etching agent

Grades Value Features
Aqueous Hydrofluoric Acid (HF) HF : 49%/50% High Quality
Low impurity level (metal content)
Ammonium Fluoride (NH4F) NH4F: 40% High Quality
Low impurity level (metal content)
Buffered Hydrogen Fluoride(BHF) Varies by mixture ratio High Quality
Low impurity level (metal content)
Buffered Hydrogen Fluoride with Surface-active Agent (BHF-U) Varies by mixture ratio Improved permeability
Reduced particle adhesion

Dry Etching agent

Grades Type Features
PFC-14  CF4 High-Purity (More than 99.999 %)
High vapor pressure
Pressure-regulated grade containing oxygen available
PFC-116 C2F6 High-Purity (More than 99.999 %)
PFC-C318 C4F8 High-Purity (More than 99.999 %)
HFC-23 CHF3 High-Purity (More than 99.999 %)
HFC-32 CH2F2 High-Purity (More than 99.999 %)

INDUSTRIES

Semicon

Semiconductor

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