Semicon Etching Agents
DAIKIN provides high quaity etching agents for wet and dry fluorine types for semiconductor manufacturing.
DESCRIPTION
DAIKIN provides etching agents for wet and dry fluorine types for semiconductor manufacturing. For wet etching agents, we provide high quality products in which impurities such as metal-ions, etc., are minimized. We also handle grades with improved permeability and reduced particle adhesion onto wafers by adding a unique surfactant.
GRADES & FEATURES
Wet Etching agent
Grades | Value | Features |
---|---|---|
Aqueous Hydrofluoric Acid (HF) | HF : 49%/50% |
High Quality Low impurity level (metal content) |
Ammonium Fluoride (NH4F) | NH4F: 40% |
High Quality Low impurity level (metal content) |
Buffered Hydrogen Fluoride(BHF) | Varies by mixture ratio |
High Quality Low impurity level (metal content) |
Buffered Hydrogen Fluoride with Surface-active Agent (BHF-U) | Varies by mixture ratio |
Improved permeability Reduced particle adhesion |
Dry Etching agent
Grades | Type | Features |
---|---|---|
PFC-14 | CF4 |
High-Purity (More than 99.999 %) High vapor pressure Pressure-regulated grade containing oxygen available |
PFC-116 | C2F6 | High-Purity (More than 99.999 %) |
PFC-C318 | C4F8 | High-Purity (More than 99.999 %) |
HFC-23 | CHF3 | High-Purity (More than 99.999 %) |
HFC-32 | CH2F2 | High-Purity (More than 99.999 %) |