Semiconductor manufacturing equipment
Materials for semiconductor manufacturing equipment require a high level of cleanliness to prevent contamination of the ultra-high-purity chemicals used, while maintaining the required standards of safety and durability.
Tubes, Fittings and Plastic parts
Required characteristics
- Stress crack resistance
- Chemical resistance
- Excellent mechanical strength
- High cleanliness
Daikin Solutions
Daikin’s fluoropolymer NEOFLON PFA AP-Series has the chemical resistance of fluoro materials, along with excellent stress crack resistance and a high level of cleanliness. This allows NEOFLON PFA to achieve a long life and high reliability necessary in tube fitting systems. Daikin’s fluoropolymer NEOFLON PCTFE M-Series is excellent for mechanical strength and cleanliness, making it the best choice for plastic made parts.
We assume that in order to discuss the possibility of residence of nano-sized particles on the inner surface of PFA tubes for semiconductor manufacturing equipment, the method for measuring the surface roughness inside the tubes must be newly invented. This report makes a proposal for a method to measure surface roughness at the nano-level and demonstrate the necessity for this measurement.
Sealing materials
Required characteristics
- Heat resistance
- Plasma resistance
- Fluorine radical durability
- Low dust generation
- Chemical resistance
- Vacuum sealability
- Non sticking
Daikin Solutions
Fluoro elastomer sealants are used for equipment placed in harsh conditions, such as plasma etching equipment. Daikin Industries developed an O-ring seal material, "DUPRA", made of perfluoro elastomer for these applications. DUPRA is provided by Daikin Finetech, under license from Daikin.
High barrier tubes
Required characteristics
- Chemical resistance
- Low chemical permeability
- Gas barrier properties
- High cleanliness
Daikin Solutions
Daikin’s Fluoropolymer NEOFLON CPT LP series has excellent low chemical permeability and gas barrier properties. When used in tubing, the permeation of chemicals and gas is greatly reduced, effectively minimizing any adverse impact on peripheral devices. In addition, tube deterioration is suppressed, and the increased durability leads to a longer device life.
